Elreha
Jordan Plant is established in Zarqa Duty Free Zone. The site
area is aproximately 2000 squared meters and contains the equipment
and personnel qualified to manufacture and deliver quality environment
control units.
Purpose
Elreha
Jordan Plant is an assembly line for previously constructed electronic
boards, provided by Elreha Printed Boards Corporation in the United
States, and electronic components (integrated circuits, transistors,
condensers and capacitors… etc) into fully functioning and tested
electronic chips that serve the needs of the customers and the public
market.
Team
and Departments
The
plant is divided into four main streams:
Engineering
Team
Assembly
and Production Team
Testing
Team
Quality
Assurance
Engineering
Team:
A
group of highly qualified and trained engineers who are responsible
of planning for the product by generating the needed time and task
schedules. The team also supervises the whole process and is responsible
of setting the machinery used in it.
Assembly
and Production Line Team:
A
group of well-qualified technicians responsible of controlling the
machinery and carrying out certain tasks needed for product manufacturing.
Testing
Team :
Elreha
Jordan plant has a team specialized in testing the products. The team
applies stricted testing procedures as dictated to us by our parent
company Elreha Germany.
Quality
Assurance:
Quality
Controllers are responsible of making sure all manufacturing steps
are in compliance with Elreha manufacturing and procedure standards.
Those standards are in compliance with ISO 9001.
Process
After
the customer submits the order, and the engineers thoroughly analyze
the technical part of the order prior to designing it, the production
process begins, and it is as follows:
An
empty board enters the production line and heads to
the “Masking Machine” where it is dyed
using a special material (mask) that is suitable for
SMT (Surface Mount Technology) components replacement.
The
masked board heads to the “Chip Replacement
Machine” which plants the SMT components into
their pre-designed locations.
The
result (the board with the SMT components) is then taken
to a high-temperature oven (over 300c) that is capable of
melting the mask applied by the Masking Machine into integrated
chip silicon. This process is called “Soldering Process”.
After
the Soldering Process, the board is taken to the “Through
Holes Line”, where a team of technicians from the
“Assembly and Production Line Team” installs
the remaining (through holes) components into their correct
locations using laser technology and soldering machines.
The
product is then ready for testing. A group of Quality Assurance
engineers and applies the required testing procedures using
special electronic devices to assure that the final product
has passed and in accordance with the previously defined
requirements and specifications.
The
product is then packaged in elegant packages using sophisticated
packaging machinery and is delivered to the customer on
the specified delivery date and time.